#cell2 * chip_1 txt * 4 any 0 v8r2.2 # "16-Jul-91 GMT" "15:18:12 GMT" "16-Jul-91 GMT" "15:18:12 GMT" td * . Estimate for chip : chip_1 Estimation Input Parameters : packagetypes = [ pdip, sb, soic, ppga, cpga, hpcpga, pjqfp, cjqfp, plcc, llccc, ldccc] libraries = [ vsc10, vsc120, vsc300, vsc320, vsc350, vsc370, vgt200, vgt300, vgt350] chipmiscdata : name chip_1 padload 50 coremhz 20 padmhz 10 inputs 0 outputs 0 Alternative 1 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vsc10 floorplan standardCells density core limited (clp) standard cell area 1052 um squ. standard cell gates 265.5 megacell area 0 um squ. core x 1119 microns (44 mils) core y 1119 microns (44 mils) core+pads x 1743 microns (69 mils) core+pads y 1743 microns (69 mils) core+pads+scribe x 2037 microns (80 mils) core+pads+scribe y 2037 microns (80 mils) power Low: 5 Typical: 7 High: 9 mW package 1 23-10099: 14 pin plastic dual in-line package package 2 23-20022: 8 pin ceramic side-brazed package package 3 23-15002: 24 pin small outline plastic package package 4 23-60019: 20 pin plastic leaded chip carrier package 5 23-65014: 28 pin leadless ceramic chip carrier Alternative 2 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vsc120 floorplan standardCells density core limited (clp) standard cell area 846 um squ. standard cell gates 265.5 megacell area 0 um squ. core x 900 microns (35 mils) core y 900 microns (35 mils) core+pads x 1719 microns (68 mils) core+pads y 1719 microns (68 mils) core+pads+scribe x 2014 microns (79 mils) core+pads+scribe y 2014 microns (79 mils) power Low: 5 Typical: 6 High: 8 mW package 1 23-10099: 14 pin plastic dual in-line package package 2 23-20022: 8 pin ceramic side-brazed package package 3 23-15002: 24 pin small outline plastic package package 4 23-60019: 20 pin plastic leaded chip carrier Alternative 3 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vsc300 floorplan standardCells density core limited (clp) standard cell area 952 um squ. standard cell gates 276.5 megacell area 0 um squ. core x 998 microns (39 mils) core y 998 microns (39 mils) core+pads x 1891 microns (74 mils) core+pads y 1891 microns (74 mils) core+pads+scribe x 2185 microns (86 mils) core+pads+scribe y 2185 microns (86 mils) power Low: 9 Typical: 13 High: 17 mW package 1 23-10102: 16 pin plastic dual in-line package package 2 23-20022: 8 pin ceramic side-brazed package package 3 23-15002: 24 pin small outline plastic package package 4 23-60019: 20 pin plastic leaded chip carrier package 5 23-65014: 28 pin leadless ceramic chip carrier Alternative 4 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vsc320 floorplan standardCells density core limited (clp) standard cell area 658 um squ. standard cell gates 287.5 megacell area 0 um squ. core x 699 microns (28 mils) core y 699 microns (28 mils) core+pads x 1592 microns (63 mils) core+pads y 1592 microns (63 mils) core+pads+scribe x 1886 microns (74 mils) core+pads+scribe y 1886 microns (74 mils) power Low: 5 Typical: 6 High: 8 mW package 1 23-10099: 14 pin plastic dual in-line package package 2 23-20022: 8 pin ceramic side-brazed package package 3 23-15002: 24 pin small outline plastic package package 4 23-60019: 20 pin plastic leaded chip carrier Alternative 5 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vsc350 floorplan standardCells density core limited (clp) standard cell area 977 um squ. standard cell gates 274.3 megacell area 0 um squ. core x 1024 microns (40 mils) core y 1024 microns (40 mils) core+pads x 1917 microns (75 mils) core+pads y 1917 microns (75 mils) core+pads+scribe x 2211 microns (87 mils) core+pads+scribe y 2211 microns (87 mils) power Low: 11 Typical: 15 High: 19 mW package 1 23-10102: 16 pin plastic dual in-line package package 2 23-20022: 8 pin ceramic side-brazed package package 3 23-15002: 24 pin small outline plastic package package 4 23-60019: 20 pin plastic leaded chip carrier package 5 23-65014: 28 pin leadless ceramic chip carrier Alternative 6 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vsc370 floorplan standardCells density core limited (clp) standard cell area 673 um squ. standard cell gates 282.9 megacell area 0 um squ. core x 715 microns (28 mils) core y 715 microns (28 mils) core+pads x 1608 microns (63 mils) core+pads y 1608 microns (63 mils) core+pads+scribe x 1902 microns (75 mils) core+pads+scribe y 1902 microns (75 mils) power Low: 5 Typical: 8 High: 10 mW package 1 23-10099: 14 pin plastic dual in-line package package 2 23-20022: 8 pin ceramic side-brazed package package 3 23-15002: 24 pin small outline plastic package package 4 23-60019: 20 pin plastic leaded chip carrier Alternative 7 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vgt200 floorplan vgt200003 (1.5u vgt200 array) core+pads x 2870 microns (113 mils) core+pads y 2870 microns (113 mils) core+pads+scribe x 3164 microns (125 mils) core+pads+scribe y 3164 microns (125 mils) occupancy 27% of max occupancy sites (Cells) 806 sites (Blocks) 0 power Low: 7 Typical: 10 High: 12 mW package 1 23-10105: 18 pin plastic dual in-line package package 2 23-20017: 22 pin ceramic side-brazed package package 3 23-15000: 20 pin small outline plastic package package 4 23-80008: 64 pin plastic pin grid array package package 5 23-61062: 100 pin plastic japanese quad flat package package 6 23-60012: 20 pin plastic leaded chip carrier package 7 23-65014: 28 pin leadless ceramic chip carrier package 8 23-67514: 28 pin leaded ceramic carrier Alternative 8 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vgt300 floorplan vgt300030 (1 u vgt300 array) core+pads x 5852 microns (230 mils) core+pads y 5852 microns (230 mils) core+pads+scribe x 6146 microns (242 mils) core+pads+scribe y 6146 microns (242 mils) occupancy 2% of max occupancy sites (Cells) 758 sites (Blocks) 0 power Low: 9 Typical: 13 High: 16 mW package 1 23-10093: 24 pin plastic dual in-line package package 2 23-20008: 24 pin ceramic side-brazed package package 3 23-80004: 84 pin plastic pin grid array package package 4 23-70002: 68 pin ceramic pin grid array package package 5 23-61061: 100 pin plastic japanese quad flat package package 6 23-69001: 100 pin ceramic japanese quad flat package package 7 23-60017: 44 pin plastic leaded chip carrier package 8 23-65013: 68 pin leadless ceramic chip carrier package 9 23-67511: 44 pin leaded ceramic carrier Alternative 9 Attribute Value recommended vsss Total: 2 External: 1 Internal: 1 recommended vdds Total: 2 External: 1 Internal: 1 technology vgt350 floorplan vgt300010 (1 u vgt350 array) core+pads x 3769 microns (148 mils) core+pads y 3769 microns (148 mils) core+pads+scribe x 4063 microns (160 mils) core+pads+scribe y 4063 microns (160 mils) occupancy 8% of max occupancy sites (Cells) 728 sites (Blocks) 0 power Low: 10 Typical: 13 High: 17 mW package 1 23-10109: 22 pin plastic dual in-line package package 2 23-20017: 22 pin ceramic side-brazed package package 3 23-80008: 64 pin plastic pin grid array package package 4 23-61062: 100 pin plastic japanese quad flat package package 5 23-69001: 100 pin ceramic japanese quad flat package package 6 23-60018: 20 pin plastic leaded chip carrier package 7 23-65014: 28 pin leadless ceramic chip carrier package 8 23-67514: 28 pin leaded ceramic carrier